The high-speed, high-accuracy solution was unveiled at Productronica 2024.

Greater Noida, September 13, 2024: OMRON Automation demonstrated its expertise in Surface Mount Technology (SMT) and Through-hole Inspection solutions at the Productronica 2024. The showcase consisted of Automated X-ray Inspection (AXI), Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) solutions.

One of the remarkable exhibits was the company’s newest solution – OMRON 3DCT AXI - X850. This technology allows for comprehensive inspection of power semiconductors by leveraging advanced X-ray capabilities. It ensures reliable detection of defects, such as voids, insufficient solder, and misalignments, thereby enhancing overall product reliability and uniformity.

Elaborating more on the need of the solution, Sameer Gandhi, MD, OMRON Automation, India, elaborated, “As the world swiftly transitions toward electric vehicles (EVs), semiconductors play a crucial role in driving this change. Semiconductor chips are central to various critical systems within EVs, impacting battery management systems (BMS), adaptive cruise control, and improving efficiency and safety. The trend towards faster charging, product miniaturisation, and increased horsepower has shifted from single-layer products to multi-layer ones, necessitating high inspection accuracy to identify defects at each layer ensuring they meet stringent quality standards, enhancing their reliability and performance in various applications.”

The showcase also had AOI systems that offer precise inspection capabilities for surface mount components, ensuring top-notch quality control inproduction processes and the SPI technology that delivers high-accuracy solder paste inspection, optimising solder joint quality for electronics assembly.

These solutions have a great utility for the automotive and networking equipment industry which have rigorous inspection and quality control necessities to ensure the safety, efficiency, and reliability of the technologies involved.

The rise of CASE and 5G is significantly increasing the demand for high-accuracy inspection due to several factors. Connected and Autonomous Vehicles rely heavily on sensors, cameras, and other advanced technologies that require precise calibration and inspection to ensure safety and reliability. Electric Vehicles involve new components and technologies in their production, and maintenance, which need specialised inspection processes. The deployment of 5G technology requires meticulous inspection of network equipment and devices to meet high standards for performance and reliability.

“As a leading provider of automation solutions, OMRON is dedicated to equipping manufacturers with the tools needed to achieve operational excellence. By showcasing its full range of inspection technologies, the company reaffirms its commitment to driving innovation and setting new standards in the semiconductor, automotive and networking equipment manufacturing industry and giving a boost to the production of digital goods in India,” Sameer added.

The solutions are notable for the following capabilities:

·Complete inspection coverage: provides all three primary inspection methods – AOI for surface defects, SPI for solder paste deposition, and AXI for deeper analysis of solder joints, including those on through-hole components.

·3D Inspection technology: advanced 3D imaging capabilities on AOI and SPI systems to accurately detect defects with better precision.

·High-speed inspection: designed for high-volume production lines, can perform inspections at fast speeds while maintaining accuracy.

·Ease of use: user-friendly programming and intuitive interfaces make it easier to set up and operate inspection programs. 

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